This chip can make future phones thinner and faster through tiny ‘earthquakes’
By Manisha Priyadarshini A chip that produces microscopic “earthquakes” could change smartphone design, allowing manufacturers to shrink internal components while boosting signal handling and data speeds using surface acoustic wave technology.
The post This chip can make future phones thinner and faster through tiny ‘earthquakes’ appeared first on Digital Trends.
Source:: Digital Trends
No comments